High-performance, multi-purpose ultraviolet laser cutting machine, with a non-contact working platform and high-speed digital galvanometer processing, avoiding hidden damage caused by tool and mold stress during processing.
High-performance, multi-purpose ultraviolet laser cutting machine, with a non-contact working platform and high-speed digital galvanometer processing, avoiding hidden damage caused by tool and mold stress during processing.
Uses 355nm ultraviolet laser, with a short wavelength, high energy density, and small thermal impact range. It eliminates the need for cooling water, cleaning water, cutting, and dust associated with mechanical processing, enabling rapid destruction of molecular structures for cold processing.
High-speed moving gantry structure with flying optical path design allows for customization with a dedicated fully automatic loading and unloading machine or pairing with an SMT line.
Capable of recognizing DXF and GERBER files, eliminating the need for molds, enabling rapid forming, cutting, and drilling. Particularly suitable for processing complex, fine, and difficult products.
CCD automatic positioning and deformation compensation function better adapts to product deformation, while the high-end automatic edge finding and cutting compensation function can accommodate offsets caused by stress processing in previous stages, ensuring smoother cutting edges.
Dual-station platform design eliminates the time needed for manual or automatic robotic material replacement, improving efficiency by 30% compared to similar market devices with equivalent laser output.
High-speed laser cutting for mobile phone camera modules, fingerprint recognition modules, TF card-type memory cards, and FPC flexible circuit boards, with a cutting thickness of up to 1mm, achieving burr-free, high precision, and minimal thermal impact range.
Self-developed control software based on WINDOWS, with a fully Chinese interface, providing simple and fast one-click operation.
