The ABT-GZ500 is used between high-power electronic components and heat sinks. Its excellent wettability allows it to quickly fill the micro-pores of the interface, significantly reducing the thermal resistance at the interface. This enables rapid and effective lowering of the temperature of electronic components, thereby extending their lifespan and improving reliability.
The ABT-GZ500 is used between high-power electronic components and heat sinks. Its excellent wettability allows it to quickly fill the micro-pores of the interface, significantly reducing the thermal resistance at the interface. This enables rapid and effective lowering of the temperature of electronic components, thereby extending their lifespan and improving reliability. In addition to its high thermal conductivity, it does not generate stress during use, remains highly stable from -45°C to +150°C, and offers excellent weather resistance and outstanding dielectric properties. It meets the current requirements of the electronics industry for thermal interface materials.
Product Features:
High thermal conductivity, low thermal resistance,good thixotropy, easy to handle, low sedimentation, excellent chemical and mechanical stability, good extrusion resistance, high reliability for long-term use, suitable for processes like screen printing, thermal conductivity coefficient: 1.0~8.0W
Product Applications:
Communication equipment, storage devices, consumer electronics, security devices, network terminals, LLED lighting, power devices
Product Packaging:
Can packaging , packaging specification: 1kg/can
Product Storage:
Storage validity: 12 months
Storage conditions: Temperature: 15°C < T < 30°C
Relative humidity: RH < 70%
Note: If sedimentation occurs, it can be stirred evenly and still be usable.
